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H5AN8G6NAFR-UHC

厂商名称: SK Hynix

H5AN8G6NAFR-UHC元件分类: 存储器

H5AN8G6NAFR-UHC英文描述:
DDR DRAM, 512MX16, CMOS, PBGA96

H5AN8G6NAFR-UHC相关的参考设计

  • 参数列表
  • 在这购买
  • H5AN8G6NAFR-UHC功能数量
    1
    H5AN8G6NAFR-UHC端子数量
    96
    H5AN8G6NAFR-UHC最小工作温度
    0.0  Cel
    H5AN8G6NAFR-UHC最大工作温度
    85.0  Cel
    H5AN8G6NAFR-UHC额定供电电压
    1.2  V
    H5AN8G6NAFR-UHC最小供电/工作电压
    1.14  V
    H5AN8G6NAFR-UHC最大供电/工作电压
    1.26  V
    H5AN8G6NAFR-UHC加工封装描述
    FBGA-96
    H5AN8G6NAFR-UHCreach_compliant
    Yes
    H5AN8G6NAFR-UHC状态
    Active
    H5AN8G6NAFR-UHC存取方式
    MULTI BANK PAGE BURST
    H5AN8G6NAFR-UHCjesd_30_code
    R-PBGA-B96
    H5AN8G6NAFR-UHC存储密度
    8.589934592E9  bit
    H5AN8G6NAFR-UHC内存IC类型
    DDR DRAM
    H5AN8G6NAFR-UHC内存宽度
    16
    H5AN8G6NAFR-UHC端口数
    1
    H5AN8G6NAFR-UHC位数
    5.36870912E8  words
    H5AN8G6NAFR-UHC位数
    512M
    H5AN8G6NAFR-UHC操作模式
    SYNCHRONOUS
    H5AN8G6NAFR-UHC组织
    512MX16
    H5AN8G6NAFR-UHC包装材料
    PLASTIC/EPOXY
    H5AN8G6NAFR-UHCpackage_code
    TFBGA
    H5AN8G6NAFR-UHC包装形状
    RECTANGULAR
    H5AN8G6NAFR-UHC包装尺寸
    GRID ARRAY, THIN PROFILE, FINE PITCH
    H5AN8G6NAFR-UHCseated_height_max
    1.2  mm
    H5AN8G6NAFR-UHC表面贴装
    YES
    H5AN8G6NAFR-UHC工艺
    CMOS
    H5AN8G6NAFR-UHC温度等级
    OTHER
    H5AN8G6NAFR-UHC端子形式
    BALL
    H5AN8G6NAFR-UHC端子间距
    0.8  mm
    H5AN8G6NAFR-UHC端子位置
    BOTTOM
    H5AN8G6NAFR-UHClength
    13.0  mm
    H5AN8G6NAFR-UHCwidth
    7.5  mm
    H5AN8G6NAFR-UHCadditional_feature
    AUTO/SELF REFRESH

    目前在售H5AN8G6NAFR-UHC的授权分销商:

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